產品規格書/Specification
產品/product: | 銀鈀漿料/Ag/Pdpaste(Pd5%) |
料號/Part number: | 02H-1805 |
適用范圍/Application:
此產品適用于厚膜電路、傳感器。
Suitable for chip resistor、thick film circuit electrode.
使用條件/Operating conditions:
基材 Substrate | 氧化鋁陶瓷 Alumina ceramic |
印刷 Printing | 200-300目絲網印刷 200-300 mesh stainless screen |
流平 Levelling | 5-15min minutes at room temperature 室溫下流平5-15分鐘(時間根據流平的實際情況決定)。 |
干燥&燒結 Drying &Sintering | 通風烘箱烘烤100-150℃,10-15分鐘 100-150℃10-15 min 隧道爐空氣氣氛下燒結,峰值850℃(推薦值),10分鐘。 Atmospheric firing in belt furnace with peak time of 10 mins at 850℃ |
Thinner | ST-1000 |
性能/Characteristics:
1.漿料性能/Paste Characteristics:
性能 Characteristic | 標準 Standard | 測試方法及條件 Test method and conditions | |
1 | Fineness | ≤5μm | FOG test |
2 | Viscosity | 130-280Pa.s | Brookfield HBT utility cup and spindle (SC4-14/6R), 10rpm,25±1℃, Brookfield HBT(博利飛)粘度計, 轉子SC4-14/6R), 10rpm,25±1℃ 粘度可根據用戶實際需要調節。 |
2.燒結后特性/Characteristics afterfiring:
在 1 燒結條件下,膜厚 8-12mm Check fired film produced under the conditions specified in 1), (Film thickness is 8-12mm.)
特性 Characteristics | Standard 標準 | 測試方法和條件 Test method and conditions | ||
3 | Resistivity 方阻 | ≤10mΩ/□ | Test pattern 0.6mm×60mm 測試圖形0.6mm×60mm | |
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