玻璃纖維聚酯采光板（FRP）與玻璃卡布隆（PC）板之性能比較
1、FRP的基材為間苯二甲酸聚脂，PC板為普通聚碳酸脂；
2、FRP的熱膨脹系數為2.2×10-5 /cm/cm /℃，PC的熱膨脹系數為6.75×10-5/cm/cm/℃；FRP的熱膨脹系數接近鋼材的熱膨脹系數，由冷熱變化而引起的相對位移較少，不易因變形而漏水。而PC板引起的相對位移過大，引致螺釘孔周緣板撕裂、變形而漏水。
3、FPR的拉力強度較高，為94MPa能承受與鋼板相近的較高荷載，抗臺風能力較強。PC的拉力強度為60MPa，承受荷載的能力弱，與鋼板承受荷載的能力相差較大，抗臺風能力弱。
4、FRP采用上下膜與玻纖加強的結構形式，使其抗拉撕裂性能較好。PC其分子結構的特殊性致使PC板的抗撕裂性能差，容易被金屬的毛刺刺裂而漏水，所以不能只用螺釘來固定，以及與金屬直接接觸，固定PC板通常采用鋁壓板。
5、FRP的采光率為50 - 85，PC的一般為85 - 91。
6、FRP的熱傳導率為0.158w/m.k，PC的為0.166w/m.k，FRP的隔熱性能勝于PC板；
7、FRP的施工成本因板材的拉力強度、鋼度較高承受荷載能力較強，能與鋼板配合在太跨度大檀距的鋼結構屋面上使用。PC的板材鋼度差以及熱脹冷縮系數大，所以需采用小分格小檀距或凸拱起弧增加強度，不適合用于大檀距的鋼結構屋面上否則容易凹下面積水、漏水。
Performance comparison between glass fiber polyester daylighting panel (FRP) and glass fiber reinforced polymer (PC) panel
1. The base material of FRP is isophthalic acid polyester, and the PC board is ordinary polycarbonate;
2. The coefficient of thermal expansion of FRP is 2.2 × 10-5 /cm/cm / ℃, thermal expansion coefficient of PC is 6.75 × 10-5/cm/cm/℃； The thermal expansion coefficient of FRP is close to that of steel, and the relative displacement caused by cold and heat changes is less, so it is not easy to leak water due to deformation. The relative displacement caused by the PC board is too large, which leads to tearing, deformation and water leakage of the plate around the screw hole.
3. FPR has a high tensile strength of 94mpa, which can bear a higher load similar to the steel plate, and has a strong typhoon resistance. The tensile strength of PC is 60MPa, and its load bearing capacity is weak, which is quite different from that of steel plate, and its typhoon resistance is weak.
4. FRP adopts the structural form of upper and lower films and glass fiber reinforcement, so that its tensile tearing performance is better. The particularity of PC molecular structure leads to poor tear resistance of PC board, which is easy to be punctured by metal burrs and water leakage, so it can not be fixed only with screws and in direct contact with metal. Aluminum pressing plate is usually used to fix PC board.
5. The daylighting rate of FRP is 50 - 85, and that of PC is generally 85 - 91.
6. The thermal conductivity of FRP is 0.158w/m.k, that of PC is 0.166w/m.k, and the thermal insulation performance of FRP is better than that of PC board;
7. The construction cost of FRP is high due to the tensile strength, high rigidity and strong load-bearing capacity of the plate. It can be used on the steel structure roof with too long span and large spacing together with the steel plate. Due to the poor rigidity and large coefficient of thermal expansion and cold shrinkage of PC plates, it is necessary to use small grid spacing or convex arch arcing to increase the strength. It is not suitable for steel structure roofs with large spacing, otherwise it is easy to accumulate water and leak water under the concave.
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