H907-U是一種單組分環(huán)氧密封粘接劑，用于CSP或BGA底部填充制程及各類電子元組件、溫度敏感產(chǎn)品、攝像頭模組等之粘接固定、密封保護(hù)等。它能形成一致和無(wú)缺陷的固化膠層，能有效降低由于硅芯片與基板之間的總體溫度膨脹特性不匹配或外力造成的沖擊，具有較低之膨脹性。受熱時(shí)能快速固化。較低的粘度特性使得其能更好的進(jìn)行底部填充、元件粘接及產(chǎn)品密封保護(hù)等。

特性：　　

固化前 　外觀 　  黑色、淡黃色

粘度(mPa.S) 　　  1500-3500 @25℃

密度 　　              1.2g/cm3

固化后 　　    玻璃轉(zhuǎn)移化溫度 　    80℃

硬度 　　              75-85shore D

剪切強(qiáng)度 　        　15Mpa

表面電阻 　　        1.5×10*15ohm/cm(25℃)

體積電阻 　　        2.5×10*16ohm/cm(25℃)

耐電壓 　           　16-18kv/mm(25℃)　　

硬化條件

1、在 150℃ 固化時(shí)間約為5-10分鐘

2、在 130℃ 固化時(shí)間約為10-20分鐘

注意：粘結(jié)部位可能需加熱一定的時(shí)間以便能達(dá)到固化的溫度。固化條件會(huì)因不同的裝置而不同。

H907-u is a one-component epoxy sealing adhesive, which is used for the bottom filling process of CSP or BGA and the bonding, fixation and sealing protection of various electronic components, temperature sensitive products, camera modules, etc. It can form a uniform and defect free curing adhesive layer, which can effectively reduce the impact caused by the overall temperature expansion characteristics mismatch or external force between the silicon chip and the substrate, and has low expansion. It can cure quickly when heated. The lower viscosity makes it better for bottom filling, component bonding and product sealing protection.

characteristic:

Appearance black and light yellow before curing

Viscosity (MPa. S) 1500-3500 @ 25 ℃

Density 1.2g/cm3

Glass transfer temperature after curing 80 ℃

Hardness 75-85shore D

Shear strength 15MPa

Surface resistance 1.5 × 10 * 15ohm / cm (25 ℃)

Volume resistance 2.5 × 10 * 16ohm / cm (25 ℃)

Withstａnd voltage 16-18kv / mm (25 ℃)

Hardening conditions

1. Curing time at 150 ℃ is about 5-10 minutes

2. The curing time at 130 ℃ is about 10-20 minutes

Note: the bonding part may need to be heated for a certain time to reach the curing temperature. Curing conditions will vary depending on the device.