本品系SMT 專用的單組份熱固化環氧樹脂膠粘劑，具有
1.貯存穩定，使用方便
2.快速固化，強度好
 3.觸變性好，電氣絕緣性能好等特點。
本品主要用于片狀電阻、電容、IC 芯片及其它電子元件的的貼裝工藝，適用于點膠和刮膠。

 特征

粘稠紅色膏狀體   比重（25℃） 1.25-1.35     粘度 （25℃）35,000-55,000 cps

保存期限：25度15天     5度2個月 
①、容許低溫度硬化；
②、盡管超高速涂敷，微少量涂敷任可保持沒有拉絲，塌陷的穩定形狀；
③、對于各種表明粘著零件，都可獲得安定的粘著強度；
④、儲存安定性能優良；
⑤、具有高耐熱性和優良的電氣特性；
⑥、也可用于印刷。

硬化條件
 120度15-20分鐘或130-150度5-10分鐘

○ 硬化溫度越高、而且硬化時間越長，越可獲得高度著強度；
○ 依裝著于基板的零件大小，及裝著位置的不同，實際附加于接著劑的溫度會變化，因此需要找出的硬化條件。

This product is a one component heat curing epoxy resin adhesive for SMT, with

1. Stable storage and convenient use

2. Fast curing, good strength

3. Good thixotropy and electrical insulation.

This product is mainly used for laminating process of sheet resistor, capacitor, IC chip and other electronic components, suitable for dispensing and scraping.

features

Viscosity red paste specific gravity (25 ℃) 1.25-1.35 viscosity (25 ℃) 35000-55000 CPS

Shelf life: 25 ° 15 days, 5 ° 2 months

① . allow low temperature hardening;

② Even though the coating is ultra-high speed, a small amount of coating can keep the stable shape without drawing and collapse;

③ For all kinds of adhesive parts, stable adhesive strength can be obtained;

④ Good storage stability;

⑤ , with high heat resistance and excellent electrical characteristics;

⑥ , can also be used for printing.

Hardening conditions

120 ° 15-20 minutes or 130-150 ° 5-10 minutes

The higher the hardening temperature and the longer the hardening time, the higher the strength can be obtained;

According to the size of the parts installed on the substrate and the different installation positions, the actual temperature of the additive will change, so it is necessary to find out the most suitable hardening conditions.